Lean Manufacturing: FlipChip Initiatives ...

FlipChip promotes lean manufacturing leader to COO position as the company begins capacity expansion. ...

... "Bob Forcier, President and CEO of FlipChip International, stated, Jay's proven track record in continuous improvement of our high quality standards, customer service and lean manufacturing initiatives is a testimonial to his capabilities and leadership skills. We are also very excited to have Jay lead our aggressive expansion in wafer processing capacity of 118% in 2006 and 2007. Customer demand has been strong under Jay's leadership and we will continue to build our capabilities with Jay directing our operations and logistic teams. Under Jay's leadership, our investments in advanced manufacturing technologies such as cell control, capacity planning, CIM, and ERP will pay many dividends to our customer service. " ...

Lean Manufacturing: FlipChip Initiatives: Via FlipChip International: FlipChip International Appoints Jay Grover as Chief Operating Officer

FlipChip growth trends:

FlipChip International Announces Record High Monthly Volumes in Wafer Level Packaging: "FCI's Spheron wafer level package for high frequency wireless applications increased 410% in the last two quarters. In addition, wafer level products utilizing lead free solders have increased to 96% of the total wafers processed as the market has moved dramatically towards lead-free production. FCI increased its capacity from 200K in 2004 to its present capacity of 375K wafers annually due to strong customer demand. "