Saturday, August 01, 2009
Wednesday, March 04, 2009
... "GLOBALFOUNDRIES will service the manufacturing needs of AMD and will also offer an expanded roadmap of technologies to third-party customers through its high-volume, global foundry services. This means that for the first time, early access to volume chip production using leading-edge technologies will not just be limited to only high-end microprocessor makers. GLOBALFOUNDRIES is proceeding with plans to expand its Dresden, Germany, manufacturing lines by bringing a second 300mm manufacturing facility with bulk silicon capabilities online in late 2009. The Dresden cluster will be re-named Fab 1 with Module 1 initially focused on production of high-performance 45nm Silicon-on-Insulator (SOI) technology, and Module 2 transitioning to 32nm bulk silicon capabilities. In addition to Fab 1 the company also plans to begin construction on a new state-of-the-art 32nm and smaller features, $4.2B manufacturing facility at the Luther Forest Technology Campus in Saratoga County, NY, in 2009. This new facility will be named Fab 2 and is expected to create approximately 1,400 new direct jobs and more than 5,000 indirect jobs in the region. Once operational, Fab 2 will be the only independently-managed, advanced semiconductor manufacturing foundry in the United States, bucking the trend of manufacturing industries leaving the U.S. " ...
Via Global Foundries: Global Semiconductor Foundry Opens
Thursday, November 13, 2008
... "AMD provided more details on what its manufacturing operations will look like once the spin-out of The Foundry Company is complete. For the Silicon on Insulator (SOI) and bulk manufacturing processes needed to build AMD CPUs and APUs, The Foundry Company plans to offer AMD 65nm, 45nm and 32nm manufacturing capabilities at: Fab 36 (Dresden), Fab 38 (Dresden), Fab 4x (Saratoga County, NY) " ...
Via AMD: Manufacturing technology strategy
Thursday, October 25, 2007
... "Building on its pioneering efforts in the adoption of Lean techniques and Automated Precision Manufacturing in semiconductor factories, AMD is joining with industry partners, including ISMI, to develop new tools and processes for further streamlining both front-end and back-end production. For example, current practice across the industry is to move wafers through the process steps in 25 wafer batches, but most of the tools can only process a few or even one wafer at a time, greatly increasing the amount of time it takes to process an entire 25 wafers, slowing the delivery to the customer and extending time-to-revenue for the manufacturer. Small Lot Manufacturing (SLM) and Single Wafer Tools (SWT) are proposed changes that would greatly improve manufacturing efficiency, but requires an industry-wide shift in thinking. Collaborating on addressing this issue and others magnifies the impact by distributing investments of time, talent and money across all the parties that ultimately benefit. " ...
Via AMD: Customer at Center of Chip Manufacturing
Rapid Prototyping, Tooling and Manufacturing: "A major break-through has been achieved in rapid manufacturing by moving from SLS to SLM. "
NGMTI: "The purpose of the Next Generation Manufacturing Technology Initiative (NGMTI) is to accelerate the development and implementation of breakthrough manufacturing technologies ... "
Manufacturing - Next Generation Manufacturing: "This will require factories that can be quickly reconfigured to adapt to changing production and that can be operated by highly-motivated and skilled knowledge workers. "
Customer Centric Enterprise: "Solving the trade-off between customer centric manufacturing on the one hand (meaning high variety and fast responsiveness) and low costs, stable capacity utilization and high quality on the other necessitates incorporating systematic methodologies for manufacturing planning, process design and quality assurance in an integrated manner. "